2025
36. L. Dai, M. Li, Y. Hu, Machine learning for thermal transport and phonon high-order anharmonicity in high thermal conductivity materials: A case study in boron arsenide, Phy. Rev. Mater. Accepted (2025)
35. M. Li, S. Li, Z. Zhang, C. Su, B. Wong, Y. Hu, Advancing Thermal Management Technology for Power Semiconductors through Materials and Interface Engineering, Acc. Mater. Res. doi/10.1021/accountsmr.4c00349 (2025)
34. M. Li, L. Dai, H. Wu, Y. Yan, J. S. Kang, S. King, P. E. McNeil, D. Butts, T. Galy, M. Marszewski, E. Lan, B. S Dunn, S. H. Tolbert, L. Pilon, Y. Hu, Ballistic Transport from Propagating Vibrational Modes in Amorphous Silicon Dioxide: Thermal Experiments and Atomistic-Machine Learning Modeling, Mater. Today Phys. 51, 101659 (2025).
2024
33. Z. Qin, L. Dai, M. Li (co-first author), S. Li, H. Wu, K. E. White, G. Gani, P. S. Weiss, Y. Hu, Moiré Pattern Controlled Phonon Polarizer Based on Twisted Graphene. Adv. Mater. 35, 2312176 (2024).
32. M. Li, K. Pan, Y. Ge, K. Huynh, M. S. Goorsky, T. S. Fisher, Y. Hu, Wafer-scale bonded GaN–AlN with high interface thermal conductance. App. Phys. Lett. 125, 032104 (2024). *Featured by the APL editors
2023
31. M. Li, H. Wu, E. M. Avery, Z. Qin, D. P. Goronzy, H. Nguyen, T. Liu, P. S. Weiss, Y. Hu. Electrically Gated Molecular Thermal Switch. Science, 382, 585-589 (2023). *Highlighted by Scientific American and selected as the Top 10 Semiconductor Stories of 2023 by IEEE Spectrum
2022
30. M. Li, L. Dai, Y. Hu, Machine Learning for Harnessing Thermal Energy: From Materials Discovery to System Optimization. ACS Energy Letters, 7, 3204-3226 (2022).
29. S. Li, Z. Q, H. Wu, M. Li, M. Kunz, A. Alatas, A. Kavner, Y. Hu, Anomalous thermal transport under high pressure in boron arsenide. Nature, 612, 459-464 (2022). *Highlighted by Scientific American, National Science Foundation, and National Academy of Engineering
28. M. Marszewski, S. C. King, T. Galy, G. Kashanchi, A. Dashti, Y. Yan, M. Li, D. M. Butts, P. E. McNeil, E. Lan, B. Dunn, Y. Hu, S. H. Tolbert, L. Pilon, Transparent silica aerogel slabs synthesized from nanoparticle colloidal suspensions at near ambient conditions on omniphobic liquid substrates. J. Colloid Interface Sci. 606, 884-897 (2022).
27. V. Wall, S. C. King, G. N. Kashanchi, S. Li, M. Li, T. Galy, D. I. Harry, S. E. Ju, M. Marszewski, L. Pilon, Y. Hu, S. H. Tolbert, Understanding the Effect of Nanoparticle Size on Thermal Conductivity in Amorphous Nanoporous Materials Made from Colloidal Building Blocks. J. Phys. Chem. C. 126, 18029-18035 (2022).
2021
26. J. S. Kang, M. Li (co-first author), H. Wu, H. Nguyen, Y. Hu, Integration of boron arsenide cooling substrates into gallium nitride devices. Nature Electronics. 4, 416–423 (2021) *Highlighted by a Perspective article in Nature Electronics
25. Z. Qin, M. Li, J Flohn, Y Hu, Thermal Management Materials for Energy-Efficient and Sustainable Future Buildings. Chem. Communications. 12, 1-7 (2021).
24. Y. Cui, Z. Qin, H. Wu, M. Li, and Y. Hu, Self-assembled manufacturing for thermal management of wearable electronics and soft robotics, Nature Communications. 12, 1284 (2021)
2020
23. Y. Cui, M. Li (co-first author), Y. Hu, Emerging interface materials for electronics thermal management: Experiments, modeling, and new opportunities. J. Mater. Chem. C. 8, 10568 (2020).
22. Y. Yan, M. Li, S. King, T. Galy, M. Marszewski, J. S. Kang, L. Pilon, Y. Hu, S. H. Tolbert, Controlling Thermal Conductivity in Mesoporous Silica Films Using Pore Size and Nanoscale Architecture. J. Phys. Chem. Lett. 11, 3731–3737 (2020).
21. S. C. King, M. Li, T. Galy, Y. Yan, J. S. Kang, V. M. Basile, Y. L. Li, M. Marszewski, L. Pilon, Y. Hu, S. H. Tolbert, Examining the role of atomic scale heterogeneity on the thermal conductivity of transparent, thermally insulating, mesoporous silica−titania thin films. J. Phys. Chem. C. 124, 27442–27452 (2020).
20. M. Ke, H. D. Nguyen, H. Fan, M. Li, H. Wu, Y. Hu, Complementary doping of van der Waals materials through controlled intercalation for monolithically integrated electronics. Nano Res. 13, 1369–1375 (2020).
19. D. M. Butts, P. E. McNeil, M. Marszewski, E. Lan, T. Galy, M. Li, J. S. Kang, D. Ashby, S. King, S. H. Tolbert, Y. Hu, L. Pilon, B. S. Dunn, Engineering mesoporous silica for superior optical and thermal properties. MRS Energy Sustain. (2020).
2019
18. M. Li, J. S. Kang, H. D. Nguyen, H. Wu, T. Aoki, Y. Hu, Anisotropic Thermal Boundary Resistance across 2D Black Phosphorus: Experiment and Atomistic Modeling of Interfacial Energy Transport. Adv. Mater. 31, 1901021 (2019)
17. M. Li, Z. Qin, Y. Cui, C. Yang, C. Deng, Y. Wang, J. S. Kang, H. Xia, Y. Hu, Ultralight and Flexible Monolithic Polymer Aerogel with Extraordinary Thermal Insulation by A Facile Ambient Process. Adv. Mater. Interfaces, 1900314 (2019).
16. J. S. Kang, M. Li, H. Wu, H. Nguyen, Y. Hu, Basic physical properties of cubic boron arsenide. Appl. Phys. Lett. 115, 122103 (2019).
15. N. A. Rongione, M. Li, H. Wu, H. D. Nguyen, J. S. Kang, B. Ouyang, H. Xia, Y. Hu, High-Performance Solution-Processable Flexible SnSe Nanosheet Films for Lower Grade Waste Heat Recovery. Adv. Electron. Mater. 5, 1800774 (2019).
14. J. S. Kang, H. Wu, M. Li, Y. Hu, Intrinsic Low Thermal Conductivity and Phonon Renormalization Due to Strong Anharmonicity of Single-Crystal Tin Selenide. Nano Lett. 19, 4941–4948 (2019).
13. J. S. Kang, M. Li, H. Wu, H. Nguyen, Y. Hu, Basic physical properties of cubic boron arsenide. Appl. Phys. Lett. 115, 122103 (2019).
12. Y. Yan, S. C. King, M. Li, T. Galy, M. Marszewski, J. S. Kang, L. Pilon, Y. Hu, S. H. Tolbert, Exploring the Effect of Porous Structure on Thermal Conductivity in Templated Mesoporous Silica Films. J. Phys. Chem. C. 123, 21721–21730 (2019).
11. M. Marszewski, S. C. King, Y. Yan, T. Galy, M. Li, A. Dashti, D. M. Butts, J. S. Kang, P. E. McNeil, E. Lan, B. Dunn, Y. Hu, S. H. Tolbert, L. Pilon, Thick Transparent Nanoparticle-Based Mesoporous Silica Monolithic Slabs for Thermally Insulating Window Materials. ACS Appl. Nano Mater. 2, 4547–4555 (2019).
2018
10. J. S. Kang, M. Li, H. Wu, H. Nguyen, Y. Hu, Experimental observation of high thermal conductivity in boron arsenide. Science. 361, 575–578 (2018). Highlighted by a Perspective article in Science
9. M. Li, J. S. Kang, Y. Hu, Anisotropic thermal conductivity measurement using a new Asymmetric-Beam Time-Domain Thermoreflectance (AB-TDTR) method. Rev. Sci. Instrum. 89, 084901 (2018).
Before 2018
8. M. Li, C. Li, J. Wang, X. Xiao, Y. Yue, Parallel measurement of conductive and convective thermal transport of micro/nanowires based on Raman mapping. Appl. Phys. Lett. 106, 253108 (2015).
7. M. Li, Z. Dai, J. Ying, X. Xiao, Y. Yue, Thermal characterization of carbon nanotube fibers based on steady-state electro-Raman-thermal technique. Acta Phys. Sin. 64 (2015).
6. M. Li, J. Zhang, X. Hu, Y. Yue, Thermal transport across graphene/SiC interface: effects of atomic bond and crystallinity of substrate. Appl. Phys. A Mater. Sci. Process. 119, 415–424 (2015).
5. M. Li, Y. Yue, Raman-based steady-state thermal characterization of multiwall carbon nanotube bundle and buckypaper. J. Nanosci. Nanotechnol. 15, 3004–3010 (2015).
4. M. Li, Y. Sun, H. Xiao, X. Hu, Y. Yue, High temperature dependence of thermal transport in graphene foam. Nanotechnology. 26, 105703 (2015).
3. Y. Yue, K. Liu, M. Li, X. Hu, Thermal manipulation of carbon nanotube fiber by mechanical stretching. Carbon N. Y. 77, 973–979 (2014).
2. M. Li, Y. Yue, Molecular dynamics study of thermal transport in amorphous silicon carbide thin film. RSC Adv. 4, 23010–23016 (2014).
1. K. Liu, M. Li, S. Cui, X. Hu, Large thermal transport phase lagging improves thermoelectric efficiency. Appl. Phys. A Mater. Sci. Process. 111, 477–481 (2013).